MAXPERKX Silicone Thermal Paste - Cooling Compound for PC CPUs (Syringe)

Description:
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Thermal compound is necessary to create a reliable transfer of heat from your computer ''''s processor to its heat sink in order to keep your CPU from over heating. 

This thermal grease can be used on the rear side of the heatsink which has no thermal pad.

It will improve the heat dissipation.

This thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU to the heat sink. 

This ensures that the heat sink and fans can work at their full capacity to remove the harmful heat away from the CPU, and prevents burnout or heat damage.

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Specification:
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Type: Silicone Fluid with 20% Metal Oxide

Thermal conductivity: 1.829 W/m-k

Thermal resistance: 0.123 C-in2/w

Dielectric Breakdown: 5.0 KV ac

Paste Colour: Grey